Unisem Group is a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies. Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging including leaded, QFN, BGA and FlipChip packages, and high-end RF and mix-signal test services. The company's turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization.